JPS6156880B2 - - Google Patents

Info

Publication number
JPS6156880B2
JPS6156880B2 JP55179779A JP17977980A JPS6156880B2 JP S6156880 B2 JPS6156880 B2 JP S6156880B2 JP 55179779 A JP55179779 A JP 55179779A JP 17977980 A JP17977980 A JP 17977980A JP S6156880 B2 JPS6156880 B2 JP S6156880B2
Authority
JP
Japan
Prior art keywords
electronic component
leadless electronic
mounting
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55179779A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57103399A (en
Inventor
Takayuki Fujita
Yoshiaki Yoshida
Toshuki Higashiura
Kunio Tanaka
Yoshiji Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP55179779A priority Critical patent/JPS57103399A/ja
Priority to EP82900046A priority patent/EP0066631A1/en
Priority to PCT/JP1981/000387 priority patent/WO1982002137A1/ja
Publication of JPS57103399A publication Critical patent/JPS57103399A/ja
Publication of JPS6156880B2 publication Critical patent/JPS6156880B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
JP55179779A 1980-12-18 1980-12-18 Device for mounting and inspecting leadless electronic part Granted JPS57103399A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP55179779A JPS57103399A (en) 1980-12-18 1980-12-18 Device for mounting and inspecting leadless electronic part
EP82900046A EP0066631A1 (en) 1980-12-18 1981-12-16 Mounting and testing equipment for leadless electronic parts
PCT/JP1981/000387 WO1982002137A1 (fr) 1980-12-18 1981-12-16 Installation de montage et de test de pieces electroniques sans fil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55179779A JPS57103399A (en) 1980-12-18 1980-12-18 Device for mounting and inspecting leadless electronic part

Publications (2)

Publication Number Publication Date
JPS57103399A JPS57103399A (en) 1982-06-26
JPS6156880B2 true JPS6156880B2 (en]) 1986-12-04

Family

ID=16071735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55179779A Granted JPS57103399A (en) 1980-12-18 1980-12-18 Device for mounting and inspecting leadless electronic part

Country Status (3)

Country Link
EP (1) EP0066631A1 (en])
JP (1) JPS57103399A (en])
WO (1) WO1982002137A1 (en])

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60142600A (ja) * 1983-12-29 1985-07-27 富士通株式会社 Ｉｃ自動装着システム
GB2173426A (en) * 1985-04-09 1986-10-15 Dynapert Precima Ltd Component placement machine
US4787143A (en) * 1985-12-04 1988-11-29 Tdk Corporation Method for detecting and correcting failure in mounting of electronic parts on substrate and apparatus therefor
JPS6354000A (ja) * 1986-08-22 1988-03-08 三洋電機株式会社 電子部品の位置検出装置
EP0341806B1 (en) * 1988-02-24 1996-12-11 CONTROL AUTOMATION, Inc. Apparatus for inspecting circuit boards with surface mounted components
EP0341944A3 (en) * 1988-05-10 1991-06-26 Gec Plessey Telecommunications Limited Improvements in or relating to methods of and apparatus for registration
DE19846960A1 (de) * 1998-10-12 2000-04-20 Battenfeld Gmbh Handhabungsvorrichtung an einer Kunststoffverarbeitungsmaschine

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5435362A (en) * 1977-08-24 1979-03-15 Tokyo Shibaura Electric Co Equipment for inspecting pattern
JPS5441466A (en) * 1977-09-07 1979-04-02 Matsushita Electric Ind Co Ltd Device for inspecting electronic apparatus circuit assembly
JPS588156B2 (ja) * 1979-01-18 1983-02-14 松下電器産業株式会社 電子部品の装着方法
JPS55118698A (en) * 1979-03-05 1980-09-11 Matsushita Electric Ind Co Ltd Device for mounting electronic part
JPS5638900A (en) * 1979-09-07 1981-04-14 Pioneer Electronic Corp Device for inspecting chip mount

Also Published As

Publication number Publication date
JPS57103399A (en) 1982-06-26
WO1982002137A1 (fr) 1982-06-24
EP0066631A1 (en) 1982-12-15

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